Temperature Effect On Pl Cu Interface

The interfacial reaction and peel strength of polyimide with copper foil at various cure schedules have been investigated by scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray photoelectron spectroscopy (XPS), and peel test to determine the temperature effect on polyimide/copper interface diffusion and adhesion. SEM studies indicate that the polyimide/copper interfaces are fairly smooth for all samples studied in this experiment. The TEM microstructure reveals the existence of a copper-polyimide interaction zone at the interface when it is cured at a temperature higher than 250-degrees-C, which also results in a high peel strength. XPS spectra revealed higher copper and carbonyl carbon contents at the polyimide interface when it is cured at a high-temperature schedule (350-degrees-C). From the results of these interface studies, it is concluded that chemical bonding resulting from the interaction of copper oxide and polyimide carbonyl group provides the binding force for polyimide and copper foil.