Challenges of Formation of Thin-Film Solid Electrolyte Layers on Non-Conductive Substrates by Electrophoretic Deposition

In this work, the challenges associated with the formation of single and bilayer coatings based on Ce0.8Sm0.2O1.9 (SDC) and CuO modified BaCe0.5Zr0.3Y0.1Yb0.1O3-delta (BCZYYbO-CuO) solid state electrolytes on porous non-conducting NiO-SDC anode substrates by the method of electrophoretic deposition (EPD) are considered. Various approaches that had been selected after analysis of the literature data in order to carry out the EPD, are tested: direct deposition on a porous non-conductive anode substrate and multiple options for creating the conductivity of the anode substrate under EPD conditions such as the reduction of the NiO-SDC substrate and the creation of a surface conducting sublayer via synthesizing a polypyrrole (PPy) film. New effective method was proposed based on the deposition of a platinum layer on the front side of the substrate. It was ascertained that, during the direct EPD on the porous NiO-SDC substrate, the formation of a continuous coating did not occur, which may be due to insufficient porosity of the substrate used. It was shown that the use of reduced substrates leads to cracking and, in some cases, to the destruction of the entire SDC/NiO-SDC structure. The dependence of the electrolyte film sinterability on the substrate shrinkage was studied. In contrast to the literature data, the use of the substrates with a reduced pre-sintering temperature had no pronounced effect on the densification of the SDC electrolyte film. It was revealed that complete sintering of the SDC electrolyte layer with the formation of a developed grain structure is possible at a temperature of 1550 degrees C.