A 6-Gb/s Wireless Inter-Chip Data Link Using 43-GHz Transceivers and Bond-Wire Antennas

Solid-State Circuits, IEEE Journal of(2009)

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摘要
A 43-GHz wireless inter-chip data link including antennas, transmitters, and receivers is presented. The industry standard bonding wires are exploited to provide high efficiency and low-cost antennas. This type of antennas can provide an efficient horizontal communication which is hard to achieve using conventional on-chip antennas. The system uses binary amplitude shift keying (ASK) modulation to keep the design compact and power efficient. The transmitter includes a differential to single-ended modulator and a two-stage power amplifier (PA). The receiver includes a low-noise amplifier (LNA), pre-amplifiers, envelope detectors (ED), a variable gain amplifier (VGA), and a comparator. The chip is fabricated in 180-nm SiGe BiCMOS technology. With power-efficient transceivers and low-cost high-performance antennas, the implemented inter-chip link achieves bit-error rate (BER) around 10-8 for 6 Gb/s over a distance of 2 cm. The signal-to-noise ratio (SNR) of the recovered signal is about 24 dB with 18 ps of rms jitter. The transmitter and receiver consume 57 mW and 60 mW, respectively, including buffers. The bit energy efficiency excluding test buffers is 17 pJ/bit. The presented work shows the feasibility of a low power high data rate wireless inter-chip data link and wireless heterogeneous multi-chip networks.
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time 18 ps,power 57 mw,on-chip antenna,transceivers,frequency 43 ghz,lna,bit error rate,amplitude shift keying,wireless interchip data link,sige,ask,low noise amplifiers,power 60 mw,wirebond antenna,power amplifiers,bicmos technology,power-efficient transceivers,wireless transceiver,low-noise amplifier,bicmos integrated circuits,wireless heterogeneous multichip networks,bit rate 6 gbit/s,low-cost high-performance antennas,pre-amplifiers,wireless inter-chip link,industry standard bonding wires,bond-wire antenna,variable gain amplifier,antennas,high-speed link,rms jitter,ge-si alloys,size 180 nm,binary amplitude shift keying modulation,error statistics,bondwire antennas,two-stage power amplifier,envelope detectors,signal-to-noise ratio,chip,gain,signal to noise ratio,power efficiency,modulation,power amplifier,low noise amplifier,energy efficient,wireless communication
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