Optimization of low temperature flip chip bonding for VCSEL arrays for polymeric-waveguide-integrated optical interconnection systems

Flip chip bonding of VCSEL (vertical-cavity surface-emitting laser) array was optimized for low temperature integration of chips and polymeric waveguide for optical interconnection systems. Using silver-coated indium bumps and controlling the bonding pressure, we successfully bonded VCSEL chips at 150ºC with a good adhesion and without any thermal damage on the waveguide. © 2003 JSAP