Improvements In Noise Suppression For I/O Circuits Using Embedded Planar Capacitors
IEEE TRANSACTIONS ON ADVANCED PACKAGING(2008)
Abstract
The performance of embedded planar capacitors in noise suppression of input/output (I/O) circuits and improvements in board impedance profile have been investigated in this paper. Simultaneous switching noise (SSN) is a critical issue in today's systems and this paper shows performance improvements by introducing thin planar embedded capacitors in the board stack up. Measurement and modeling results by including the effects of transmission lines and the power ground plane pairs in the board stack up in the gigahertz range quantify the performance of the embedded capacitors.
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Key words
decoupling capacitors, embedded planar capacitors, measurement, modal decomposition, modeling, package, power delivery, simulation, simultaneous switching noise
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