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808nm大功率半导体激光器阵列的优化设计

High Power Laser and Particle Beams(2011)

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Abstract
采用激射波长为808 nm的GaAs/AlGaAs梯度折射率波导分别限制单量子阱结构外延片,制备了沟道深度不同的半导体激光器阵列,并对载流子分布进行理论分析和模拟。理论和实验结果表明:引入脊形台面和隔离沟道后,激光器阵列的输出功率、电光转换效率、斜率效率和光谱特性均有显著提高。随着沟道的加深,对电流侧向扩散的限制作用增强,从而提高了阵列性能。
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current distribution,etching depth,recess,current expansion,semiconductor laser bar
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