微通道板双面抛光技术
Semiconductor Technology(2007)
Abstract
基于微通道板皮料、芯料、实体边玻璃材料的特点,分析了微通道板的双面抛光机理,研究了抛光工艺参数(抛光粉、抛光压力、抛光液pH值等)对MCP平面粗糙度、表面质量的影响,提出了微通道板的抛光工艺及参数:抛光粉应选择莫氏硬度为6、粒度为1.5μm的CeO2;抛光压力和时间按照特定的台阶式工艺进行。抛光液的pH值对MCP表面粗糙度有较明显的影响,pH值会随抛光时间延长而升高,宜控制在6~8。
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Key words
pH value,surface roughness,double-sided polishing,microchannel plate
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