汽相再流焊工艺技术研究
Aerospace Manufacturing Technology（2013）
Abstract
介绍了汽相再流焊的主要工艺特点,分析了汽相再流焊片式元件容易立碑的原因及控制方法,并对温度曲线加热因子与金属间化合物层厚度和焊点组织的关系进行了研究。
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Key words
tombstoning,inter-metallic compound,temperature profile,vapor phase reflow soldering,heating factor
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