A comparative evaluation of spin-on-glass cure by FTIR technique
Journal of Electronic Materials(1991)
Abstract
Planarization techniques requires a deeper understanding of spin-on-glass (SOG) material behaviour. Besides chemical properties,
the cure processes are becoming more and more relevant to achieve a positive impact over microelectronic devices manufacturing
flow. In this paper we present a comparative evaluation of different thermal and plasma SOG treatments as detectable by FTIR
technique. As far as the vacuum cure is concerned, we found 425‡ C at 300 mTorr a suitable process window. In order to investigate
the plasma cure effect on SOG materials we used N2 plasma connected to either a radio frequency or microwave power generator. We found these plasmas not effective in SOG curing.
The O2 plasma, in a barrel type reactor connected to a radio frequency generator, resulted in both an effective material shrinkage
by an ashing reaction, and C elimination by an oxydation reaction. These results, together with the non cumulative effects
of plasma and the vacuum cure, represent the more relevant conclusions of our investigation. Thus, the simple vacuum cure
process has been found the most suitable for microelectronics manufacturing applications.
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Key words
SOG,vacuum cure,FTIR spectra
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