电磁波带隙材料的低温共烧陶瓷技术制备及性能

Electronic Components and Materials(2012)

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Abstract
根据共面紧凑型光子晶体的原理和HFSS仿真结果设计了禁带位于超宽带(UWB,3.1~10.6 GHz)范围的EBG(电磁波带隙)结构,然后采用低温共烧陶瓷(LTCC)工艺制备出了设计的EBG结构。利用光学显微镜和扫描电子显微镜观察了所制EBG结构的微观结构,结果显示烧结体中陶瓷与银电极结合良好。另外,经HP8720ES矢量网络分析仪测试发现其电磁波禁带位于4.0~5.5 GHz,深度大于20 dB。
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Key words
electromagnetic band-gap(EBG),Low temperature co-fired ceramics(LTCC),ultra-wideband(UWB)
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