Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints
Rare Metals(2007)
摘要
Lap joints with a 1 mm(2) cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.
更多查看译文
关键词
composite solder,stress,creep rupture life,particle-enhancement,63Sn37Pb
AI 理解论文
溯源树
样例
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要