Circuit and Physical Design of the Zenterprise™ EC12 Microprocessor Chips and Multi-Chip Module.
IEEE journal of solid-state circuits（2014）
关键词
Chip integration,chip thermal modeling,circuit design methodology,clock distribution,clock grid,CMOS digital integrated circuits,design for reliability,design for test,digital circuits,EC12,high-frequency CMOS design,high-k/metal-gate,microprocessor test,microprocessors,multi-chip module,NBTI,PBTI,power efficiency,reliability,SRAM,structured synthesis,system z,32 nm SOI,VLSI design,ZEC12,zEnterprise
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