In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation

JOURNAL OF MATERIALS RESEARCH(2010)

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摘要
In situ investigation of the interfacial reaction in the Sn/Cu thin film during aging, and reflow was carried out by synchrotron radiation with high intensity and high resolution of x-ray. With this technique, the phase transformation and evolution of the Sn/Cu thin film during heat treatment can be directly and continuously investigated. Moreover, the information for coefficient of thermal expansion in intermetallic compounds was also evaluated by this approach.
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关键词
synchrotron radiation,soldering
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