The effects of plasma surface modification on the molding adhesion properties of Film-BGA package

The main purpose of this investigation is to study and calculate the adhesion strength more easily with quantitative rules in surface modification. The adhesion properties of film ball grid array (Film-BGA) substrate under various plasma treatments were also analyzed. Optimization of the plasma surface modification processes was achieved by varying parameters, such as radio frequency (RF) power, operating vacuum pressure, processing time, and flow rate of the chamber for the mixture of argon and oxygen gases.