UV Lithography and Molding Fabrication of Ultrathick Micrometallic Structures Using a KMPR Photoresist
Microelectromechanical Systems, Journal of(2010)
摘要
By using a novel negative-tone photoresist, KMPR, we have investigated ultraviolet (UV) lithographic microelectroforming fabrication of ultrathick metallic microstructures ( ?? 400 ??m). Scanning coating spin speed together with the film thickness and uniformity has been characterized at low spin speed from 1000 to 200 r/min. Based on the film profile characterization, the single-spin lithography conditions for a 400-??m-thick electroforming mold are optimized by scanning process parameters of UV exposure energy and bake temperature and time. SEM-measured dimensional accuracy and sidewall verticality of the optimized thick KMPR mold are ?? ?? 3 ??m and 90?? ??1??, respectively, which are comparable to those of SU8 molds. The SEM analysis of the patterned film and the electroformed structure has shown that the submillimeter-thick KMPR features have ~ 5-10:1 aspect ratio. The sidewall surface roughness of the copper deposition is locally measured to be about ~ 50-100 nm by atomic force microscopy, which is significantly smoother than that resulting from other mechanical machining approaches. This novel photoresist enables the lithographic molding microfabrication process to mass produce plastic and metallic microcomponents for various microelectromechanical systems applications.
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关键词
ultraviolet (UV),atomic force microscopy,UV lithography,copper deposition,sidewall surface roughness,surface roughness,lithographic molding microfabrication process,moulding,negative tone photoresist,molding,SEM analysis,mechanical machining approach,ultraviolet lithographic microelectroforming fabrication,coating spin scanning,ultrathick micrometallic structure molding fabrication,KMPR,UV exposure energy,lithography,size 400 mum,electroforming mold,bake temperature,single-spin lithography,KMPR photoresist,microfabrication,microelectromechanical systems,electroforming,metallic microcomponents,scanning electron microscopy,ultraviolet lithography,film profile characterization,photoresists,aspect ratio
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