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S波段小型化高增益集成功放设计

LIN Chuan,Bin Yang,Quansheng Xu,Xiaolin Yuan,Qun Gao

Research & Progress of SSE（2013）

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Abstract
介绍了一种S波段小型化集成功放模块的设计方法。该模块采用GaAs和硅功率芯片,通过内匹配混合集成电路技术,将两级芯片集成到金属密封管壳中。实测结果表明,在脉宽200μs,占空比10%的测试条件下,3.1～3.4GHz全带内功率放大器输出功率能达到60W,36V电源效率大于35%,模块尺寸仅为26.5mm×15.0mm×5.0mm。
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Key words
High gain,Miniature size,Mix integrate circuit,Power amplifier(PA)
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