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高频声表面波器件用压电晶圆清洗技术研究

Piezoelectrics & Acoustooptics(2013)

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Abstract
论述了低浓度碱性过氧化氢清洗液兆声清洗钽酸锂、铌酸锂和水晶等压电晶圆的工艺技术.在保持压电晶圆特性的前提下,该技术可有效去除晶圆表面小于0.2 μm的附着颗粒,使其表面洁净度满足亚微米线宽高频声表面波(SAW)器件生产要求,同时降低了化学品、去离子水的消耗量及对环境的污染.
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Key words
Megasonic cleaning,Piezoelectric wafer,SAW technique
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