Single-crystalline Ge p-channel thin-film transistors with Schottky-barrier source/drain on flexible polyimide substrates

IEEE Electron Device Letters(2010)

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摘要
We fabricated the single-crystalline Ge (sc-Ge) p-channel thin-film transistors (TFTs) with Schottky-barrier source/drain (S/D) on flexible polyimide substrates by a simplified low-temperature process (≤ 250°C), which preserves the high mobility Ge channel. Adhesive wafer bonding and Smart-Cut techniques were utilized to transfer the sc-Ge thin film onto polyimide substrates. The device has a linear hole mobility of ~170 cm2V-1s-1, saturation hole mobility of ~120 cm2V-1s-1, and Ion of ~1.6 μA/μm at Vd = -1.5 V for the channel width/length = 280/15μm.
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关键词
schottky barriers,adhesive bonding,elemental semiconductors,flexible electronics,germanium,thin film transistors,ge,schottky-barrier source/drain,adhesive wafer bonding,flexible polyimide substrates,linear hole mobility,saturation hole mobility,simplified low-temperature process,single-crystalline p-channel thin-film transistors,smart-cut techniques,etching,thin film,thermal resistance,schottky barrier,logic gates,indium tin oxide,temperature,thin film transistor
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