Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.

Alain Phommahaxay,Anne Jourdain,Greet Verbinnen,Tobias Woitke,Peter Bisson,Markus Gabriel,Walter Spiess,Alice Guerrero,Jeremy McCutcheon,Rama Puligadda,Pieter Bex,Axel Van den Eede,Bart Swinnen,Gerald Beyer,Andy Miller,Eric Beyne

3D Systems Integration Conference（2012）

Cited 22|Views61

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Abstract

Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in device processing over the past years. While these elements are now mature enough for high-volume manufacturing, thin wafer debonding and handling still remain challenging. Hence this work focuses on a novel ZoneBOND approach to face these challenges.

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Key words

integrated circuit manufacture,three-dimensional integrated circuits,wafer bonding,3D stacked IC manufacturing,3D stacked IC technology,ZoneBON temporary bonding process,high-volume manufacturing,room temperature peel debonding,temperature 293 K to 298 K,temporary wafer bonding,ultrathin wafer handling

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