The effects of bonding temperature, pressure and holding time on the shear strength of diffusion bonded Ti3SiC2/Ni joints

Diffusion bonding of Ti3SiC2 and nickel has been conducted at temperatures of 800 similar to 1100 degrees C for 10 similar to 90 min under 6 similar to 20 MPa in vacuum. The effects of bonding temperature, bonding pressure and holding time were studied by orthogonal experiments. Joints strengths were determined through shear test. The results demonstrated that the maximum shear strength of (121 +/- 7) MPa, which is close to the shear strength of Ti3SiC2, has been obtained in the condition of 1000 degrees C for 10 min under 20 MPa.