Mems Packaging Materials

This chapter discusses the differences between the heritage microcircuit packaging world and the still evolving MEMS packaging arena. Materials used in the packaging of MEMs are reviewed and their respective applications. The packaging schemes for these devices owe their infrastructure base to the body of knowledge surrounding semiconductors and microcircuits. MEMS devices yield new complexities which drive new packaging solutions. As opposed to traditional microcircuit chips, MEMS often include moving structures along with the need to have contact with the external environment, driving the requirements for packaging such components. Thus, some functions include interaction with the surrounding environment, such as pressure sensors. This imposes new requisites on packaging, since in regular microelectronics the chip must be protected completely from any impact from the environment. Packaging also provides mechanical support to the sensitive chip, facilitating the handling of the chip, and simplifying assembly. This chapter emphasizes the materials involved in packaging MEMS devices and the addresses the challenges involved. Included in this chapter are several case studies demonstrating novel packaging/material solutions.