高高宽比硬X射线聚焦波带片的制作
Microfabrication Technology(2008)
Abstract
相对于软X射线显微成像,硬X射线显微成像对菲涅尔波带片的吸收体厚度提出了更高的要求。采用电子束光刻和X射线光刻复制的方法,在聚酰亚胺薄膜上成功制作了高高宽比的菲涅尔波带片。首先利用电子束光刻和微电镀技术制作了X射线光刻的掩模,然后利用X射线光刻和微电镀制作了高高宽比、线条侧壁陡直的菲涅尔波带片。复制后的波带片最外环宽度500 nm,直径1 mm,吸收体金厚度为3.6μm,高宽比达到7.2,可用于10 keV~25 keV的硬X射线成像。
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Key words
Electron beam lithography,Fresnel zone plate,Hard X-rays,High aspect ratio,X-ray lithography
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