Cross-Correlation Of Specification And Rtl For Soft Ip Analysis

Design, Automation and Test in Europe Conference and Exhibition(2014)

引用 11|浏览0
暂无评分
摘要
Semiconductor companies often use 3rd party IPs in order to improve their design productivity. In practice, there are risks involved in using a 3rd party IP as bugs may creep in due to versioning issues, poor documentation, and mismatches between specification and RTL. As a result of this, 3rd party IP specification and RTL must be carefully evaluated. Our methodology addresses this issue, which cross-correlates specification and RTL to discover these discrepancies. The key innovative ideas in our approach are to use prior and trusted experience about designs, which include their specs and RTL code. Also, we have captured this trusted experience into two knowledge bases (KB), Spec-KB and RTL-KB. Finally, knowledge base rules are used to cross-correlate the RTL blocks to the specs. We have tested our approach by analyzing several 3rd party IPs. We have defined metrics for specification coverage and RTL identification coverage to quantify our results.
更多
查看译文
关键词
formal specification,industrial property,integrated circuit design,system-on-chip,3rd party IP specification,RTL code,RTL identification coverage,RTL-KB,SoC designs,knowledge base rules,semiconductor companies,soft IP analysis,spec-KB,specification cross-correlation,system on chip designs
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要