Finite element analysis of biaxial scanning device based on integrated simulation technique

A thermal analysis was performed on a biaxial scanning device of a 3-axis stability satellite to get the temperature variations of the device. The temperature field, which represents worst working condition, was imported to a structural model as a set of boundary condition. A few optical parameters were separated from the deformation results of the structural analysis to evaluate the thermal controlling system inside the device, and furthermore to provide some useful design data. © 2011 IEEE.