Toward the integration of a single carbon nanofibre as via interconnect

J COIFFIC,H. Le Poche,D. Mariolle,N. Chevalier,S. Olivier,M. Fayolle,S. Maitrejean

Microelectronic Engineering（2008）

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摘要

The use of carbon nanotube/nanofibres as via interconnects is widely studied. As the vias dimensions decrease below 50nm, the number of carbon nanotubes could be close to the unity in each via hole. In the present study we show the integration processes to obtain interconnects made of one single vertically free standing carbon nanofibre. Two different catalyst integrations are detailed and tested.

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关键词

vias dimension,carbon nanotubes,afm,nanofibre,ssrm,present study,free standing carbon nanofibre,different catalyst integration,single carbon nanofibre,carbon nanotube,interconnects

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