基本信息
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Bio
Zsolt Tőkei joined Imec, Leuven, Belgium, in 1999, as a Process Engineer in the field of copper low-k interconnects, the Head of the Metal Section, and then, he became a Principal Scientist and the Program Director of Nano-interconnects, and in 2016, he became a Distinguished Member of Technical Staff, where he was involved in the range of interconnect issues including scaling, metallization, electrical characterization, module integration, reliability, and system aspects.
Research Interests
Papers共 311 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.498-505, (2024)
Advanced Etch Technology and Process Integration for Nanopatterning XIII (2024)
MICROELECTRONIC ENGINEERING (2024): 112141
Akhilesh Kumar Mandal,Marleen H. van der Veen,Negin Rahnemai Haghighi, Max Robson,Niels Claessens,Johan Meersschaut,Nicolas Jourdan,Zsolt Tokei,Annelies Delabie
ADVANCED MATERIALS TECHNOLOGIESno. 5 (2024)
D. Montero,N. Buccheri, Q. Lin, S. Roy,S. Paolillo,C. Wu,Y. Hermans,S. Decoster,B. Baudemprez, J. F. Finoulst,F. Lazzarino,S. Park,
ADVANCED ETCH TECHNOLOGY AND PROCESS INTEGRATION FOR NANOPATTERNING XIII (2024)
Anshul Gupta,Giulio Marti,Gilles Delie,Souvik Kundu,Stefan Decoster,Olalla Varela Pedreira,Bart Kenens,Anita Farokhnejad, Yannick Hermans, Bart de Wachter, Anton Gavrilov,Alicja Lesniewska,
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
Chen Wu, Vincent Renaud,Stephane Lariviere,Stefan Decoster, Yannick Hermans,Quoc Toan Le, Hanne DeCoster,Bart Kenens, Diana Tsvetanova, Alfonso Sepulveda Marquez,Gayle Murdoch,Seongho Park,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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Author Statistics
#Papers: 300
#Citation: 3349
H-Index: 27
G-Index: 43
Sociability: 7
Diversity: 1
Activity: 2
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