基本信息
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Career Trajectory
Bio
Zizhen Cheng (Student Member, IEEE) was born in Jiangsu, China, in 2001. He received the B.S. degree in electronic and electrical engineering in 2022 from Xi'an Jiaotong University, Xi'an, China, where he is currently working toward the Ph.D. degree in electronic and electrical engineering.
His research interest includes the high-temperature packaging and integration of the wide-bandgap semiconductor device.
Research Interests
Papers共 11 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Transactions on Power Electronicsno. 99 (2024): 1-17
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)pp.2574-2579, (2024)
2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)pp.1078-1082, (2023)
IEEE Transactions on Power Electronicsno. 6 (2023): 6886-6890
2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)pp.154-158, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-6, (2023)
2023 IEEE Energy Conversion Congress and Exposition (ECCE)pp.5801-5805, (2023)
2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)pp.853-858, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
2022 International Conference on Power Energy Systems and Applications (ICoPESA)pp.46-53, (2022)
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