基本信息
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Bio
Zhong-Jie Hong received the B.S. and M.S. degrees in physical from Tamkang University (TKU), New Taipei City, Taiwan, in 2010 and 2017, respectively. He is currently pursuing the Ph.D. degree with the International College of Semiconductor Technology, National Chiao Tung University (NCTU), Hsinchu, Taiwan.
He currently works with the 3DIC Laboratory, NCTU, where he has been studying 3-D integration circuit (3-D IC) package and heterogeneous integration since 2018. His study focuses on Cu-to-Cu low-temperature bonding.
Research Interests
Papers共 12 篇Author StatisticsCo-AuthorSimilar Experts
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Mu-Ping Hsu, Wen-Tsu Tsai,Ou-Hsiang Lee, Chi-Yu Chen,Tzu-Ying Kuo,Hsiang-Hung Chang,Hsin-Chi Chang,Zhong-Jie Hong,Kuan-Neng Chen
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.2131-2135, (2024)
IEEE Electron Device Lettersno. 99 (2024): 1-1
APPLIED SURFACE SCIENCE (2023): 157645-157645
IEEE Electron Device Lettersno. 3 (2023): 492-495
Zhong-Jie Hong,Demin Liu, Shu-Ting Hsieh,Han-Wen Hu,Ming-Wei Weng,Chih-I Cho,Jui-Han Liu,Kuan-Neng Chen
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (2022)
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