基本信息
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Bio
Zhiwei Fu received the B.S. degree in applied physics from the Hunan Institute of Engineering, Xiangtan, China, in 2014, and the M.Sc. degree in microelectronics and solid state electronics from the South China University of Technology, Guangzhou, China, in 2017. He is currently pursuing the Ph.D. degree with Shandong University, Jinan, China.
He joined the Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, CEPREI, Guangzhou China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI), Guangzhou, in 2015. He has authored widely over ten papers in journals and international conferences and applied for eight patents. His current research interests include reliability of advanced packaging and thermal management technology.
Research Interests
Papers共 46 篇Author StatisticsCo-AuthorSimilar Experts
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APPLIED PHYSICS LETTERSno. 6 (2024)
PHYSICAL CHEMISTRY CHEMICAL PHYSICSno. 14 (2023): 10175-10183
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2023)
Research Square (Research Square) (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
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