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个人简介
He has authored or coauthored over 120 technical papers in refereed journals and conference proceedings. His current research interests include computational modeling and stress analysis, design for reliability, stress sensors, impact dynamics, advanced integrated circuit (IC) and microsystems packaging development, and 3-D IC integration with through silicon via technology.
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论文共 239 篇作者统计合作学者相似作者
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INTERNATIONAL JOURNAL OF THERMAL SCIENCES (2024): 108741-108741
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong,Keng Yuen Jason Au, Jun Wei Javier Ong,King Jien Chui, Jun Li,Hongying Li,Duc Vinh Le,Jing Lou
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 397-405
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.734-737, (2023)
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong, Keng Yuen Jason Au,King Jien Chui,Jing Lou,Hongying Li,Duc Vinh Le
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1964-1968, (2023)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.880-884, (2022)
Li Hongying, Pan Lunsheng,Lou Jing,Zhang Xiaowu,Le Ducvinh,Cheng Ming, Li Jun,Kang Chang Wei,Chui King Jien,Feng Huicheng
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.1-5, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1680-1686, (2022)
SSRN Electronic Journal (2022)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.118-124, (2021)
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