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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 258 篇作者统计合作学者相似作者

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Process optimization of MP18 semi-damascene interconnects with fully self-aligned vias at sub-2nm nodes
Assawer Soussou, Giulio Marti,Zsolt Tokei,Seongho Park, Benjamin Vincent
Advanced Etch Technology and Process Integration for Nanopatterning XIII (2024)
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Extreme UV Self-Aligned Double Patterning process optimization for BEOL interconnections on 3nm nodes and beyond
D. Montero, N. Buccheri, Q. Lin, S. Roy,S. Paolillo,C. Wu, Y. Hermans,S. Decoster, B. Baudemprez, J. F. Finoulst,F. Lazzarino,S. Park,
ADVANCED ETCH TECHNOLOGY AND PROCESS INTEGRATION FOR NANOPATTERNING XIII (2024)
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Towards accurate temperature prediction in BEOL for reliability assessment (Invited)
Melina Lofrano, Herman Oprins, Xinyue Chang,Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman,Ivan Ciofi, Kristof Croes, Seongho Park,Zsolt Tokei
IRPSpp.1-7, (2023)
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Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node
Chen Wu, Vincent Renaud, Stephane Lariviere,Stefan Decoster, Yannick Hermans,Quoc Toan Le, Hanne DeCoster, Bart Kenens, Diana Tsvetanova, Alfonso Sepulveda Marquez,Gayle Murdoch,Seongho Park,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N
Ankit Pokhrel,Anshul Gupta,Min-Soo Kim,Jean-Philippe Soulie, Sujan Kumar Sarkar,Yann Canvel, Vincent Renaud,Bart Kenens, Blake Hodges,Trent Josephsen, Sabine O'Neal,Quentin Herr,
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAMpp.1-3, (2023)
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Impact of Ru Deposition Method and Adhesion Layer on Electrical Performance of Semi-damascene Interconnects
Gilles Delie,Elisabeth Camerotto, Giulio Marti, Ankit Pokhrel,Gayle Murdoch,Anshul Gupta,Stefan Decoster,Souvik Kundu,Seongho Park,Zsolt Tokei
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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