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Yuandong Guo received the B.S. degree in automation from the Beijing Institute of Technology, Beijing, China, in 2006. He is currently pursuing the Ph.D. degree in electrical engineering with the EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA. From 2007 to 2015, he worked at the China Electronic Product Reliability and Environmental Testing Research Institute as a Senior Engineer in electromagnetic compatibility. From 2015 to 2016, he was a Visiting Scholar with the EMC Laboratory, Missouri University of Science and Technology. His research interests include high-speed channel modeling, dielectric material characterization, surface roughness effect analysis, PDN impedance measurement techniques, and EMC issues of power inverter and 3-phase motor in electric-vehicle.
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2023 JOINT ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY, APEMC/INCEMICpp.55-58, (2023)
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.688-692, (2023)
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IEEE Transactions on Signal and Power Integrity (2022): 150-159
IEEE Transactions on Signal and Power Integrity (2022): 130-139
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)no. 3 (2022): 291-291
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2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)pp.735-738, (2022)
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2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)pp.742-745, (2022)
IEEE Transactions on Signal and Power Integrity (2022): 93-103
2021 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY, AND EMC EUROPE (EMC+SIPI AND EMC EUROPE)pp.492-497, (2021)
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