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Bio
Youngwoo Kim (Member, IEEE) received the B.S. degree in electrical engineering from Korea University, Seoul, South Korea, in 2013, and the M.S. and Ph.D. degrees in electrical engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2015 and 2018, respectively.
Since 2019, she has been an Assistant Professor with the Division of Information Science, Nara Institute of Science and Technology (NAIST), Nara, Japan. Before joining NAIST, he was a Postdoctoral Researcher with KAIST Information and Electronics Institute. Her research articles focus on system-level signal/power integrity simulation methodology, statistical analysis, advanced packaging for 2.5-D/3-D integration, hardware security, and electromagnetic interference/electromagnetic compatibility.
Dr. Kim is an Associate Editor for IEEE Transactions on Components, Packaging, and Manufacturing Technology.
Research Interests
Papers共 85 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 256-269
Micromachinesno. 10 (2023): 1880-1880
IEEE ACCESS (2023): 132699-132707
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