基本信息
views: 12
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
Bio
From 2009 to 2010, he was a process engineer in Lam Research, Fremont, CA, where he worked on process engineering research, development, modification, and evaluation for advanced semiconductor devices especially on 32nm or below technology node. In 2010, he joined Intel Corporation, Hillsboro, OR, USA as PTD process integration engineer.
He had worked on exploring and demonstrating the feasibility of new technology elements & integration schemes, materials, process modules, and technology scaling for Cu/ low k interconnection.(14nm technology node)
Research Interests
Papers共 169 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
npj 2D Materials and Applicationsno. 1 (2024): 1-9
Small (Weinheim an der Bergstrasse, Germany)no. 19 (2024): e2309467-e2309467
IEEE ELECTRON DEVICE LETTERSno. 7 (2023): 1040-1043
Advanced Materials Interfaces (2023)
Proceedings of the National Academy of Sciences of the United States of Americano. 28 (2023)
ACS applied materials & interfacesno. 49 (2023): 57879-57889
ACS applied materials & interfacesno. 26 (2023): 31608-31616
Load More
Author Statistics
#Papers: 162
#Citation: 3338
H-Index: 28
G-Index: 53
Sociability: 6
Diversity: 3
Activity: 163
Co-Author
Co-Institution
D-Core
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn