基本信息
浏览量:0
职业迁徙
个人简介
Yanwei Dai received the B.E. degree in engineering mechanics from Wuhan University of Technology, Wuhan, China, in 2011, the M.E. degree in solids mechanics from China Agricultural University, Beijing, China, in 2013, and the Ph.D. degree in mechanics from Tsinghua University, Beijing, China, in 2018.
He has been an Associate Professor with the Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, since 2020. He has authored or coauthored more than 40 SCI-indexed journal articles. He has been a Principal Investigator of more than ten projects which were granted by NSFC, BJNSF, or enterprises. His current research interests include the areas of fracture mechanics at elevated temperature in materials science and engineering as well as reliability evaluation and mechanical behavior characterization of the materials and structures in electronic packaging.
研究兴趣
论文共 109 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Theoretical and Applied Fracture Mechanicspp.104397, (2024)
International Journal of Fatiguepp.108382, (2024)
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2024): 108171
Journal of Electronic Materialsno. 2 (2024): 1035-1057
SOLDERING & SURFACE MOUNT TECHNOLOGY (2024)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.i-v, (2023)
CMES-COMPUTER MODELING IN ENGINEERING & SCIENCESno. 2 (2023): 1481-1502
ENGINEERING FRACTURE MECHANICS (2023): 109139-109139
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn