基本信息
views: 0
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
Bio
Yansong Yang (Member, IEEE) received the B.S. degree in electrical and electronic engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2014, and the M.S. and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana–Champaign (UIUC), Urbana, IL, USA, in 2017 and 2019, respectively.
He is currently an Assistant Professor with the Department of Electronic and Computing Engineering, Hong Kong University of Science and Technology, Hong Kong. His research interests focus on developing multiphysics (including electrical, mechanical, and optical domains) hybrid microsystems for signal processing, sensing, and computing on a single chip.
Prof. Yang has won the Second Place in Best Paper Competition at the 2018 IEEE International Microwave Symposium and the Best Paper Award at the 2019 IEEE International Ultrasonics Symposium. He was also a finalist for the Best Paper Award at the 2018 IEEE International Frequency Control Symposium and the Advanced Practices Paper Competition Award at the 2020 IEEE International Microwave Symposium. He was also a recipient of the 2019 P. D. Coleman Graduate Research Award from the Department of Electrical and Computer Engineering, UIUC, and the 2022 Microwave Prize from the IEEE Microwave Theory and Techniques Society. He currently serves as the Chair for the IEEE Hong Kong Electron Device/Solid-State Circuits Joint Chapter.
Research Interests
Papers共 91 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2024 IEEE 37TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMSpp.36-39, (2024)
Yi Deng, Yi Zhang,Xinyuan Zhang,Yang Jiang,Xi Chen,Yansong Yang,Xin Tong,Yao Cai,Wenjuan Liu,Chengliang Sun,Dashan Shang,Qing Wang,
Advanced Scienceno. 26 (2024): n/a-n/a
Haochen Zhang, Hu Wang,Mingshuo Zhang,Lei Yang,Yankai Ye,Hongtu Qian, Xinchuan Zhang,Chengjie Zuo,Yansong Yang,Yi Pei,Haiding Sun
IEEE Electron Device Lettersno. 99 (2024): 1-1
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023pp.907-910, (2023)
CHIPno. 4 (2023): 100058-100058
2022 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS, IMWS-AMPpp.1-3, (2022)
IEEE transactions on microwave theory and techniques (2022): 5185-5194
Load More
Author Statistics
#Papers: 82
#Citation: 1404
H-Index: 21
G-Index: 35
Sociability: 4
Diversity: 3
Activity: 21
Co-Author
Co-Institution
D-Core
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn