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个人简介
Xueping Guo received the B.Sc. degree in mechanical design from Chang’an University, Xi’an, China, in 2007, and the master’s degree in mechanical engineering from the Beijing University of Technology, Beijing, China, in 2010.
Since 2010, he has been a Senior Engineer with the Institute of Microelectronics of Chinese Academy of Sciences, Beijing, and responsible for a number of national science and technology major projects. He has authored over 20 papers in international journals and conferences and holds 20 invention patents. His current research interests include microelectronics advanced packaging technology, active passive embedded packaging technology based on the organic substrate, system-in-package technology, and assembly technology.
研究兴趣
论文共 27 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 11 (2018): 1967-1978
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作者统计
#Papers: 27
#Citation: 105
H-Index: 6
G-Index: 6
Sociability: 4
Diversity: 1
Activity: 0
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