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个人简介
Xu Yan (Graduate Student Member, IEEE) received the B.S. degree (Hons.) in electronic information engineering from the Nanjing University of Aeronautics and Astronautics, Nanjing, China, in 2016, and the M.Eng. degree in electronics engineering from the University of Science and Technology of China, Hefei, China, in 2019. He is currently pursuing the Ph.D. degree at the Department of Electrical and Computer Engineering, National University of Singapore, Singapore.
From January 2017 to January 2018, he was an Assistant Director with Anhui Transilica Microelectronics Company Ltd. (ATM), Hefei. His current research interests include Si/GaAs/GaN-based wideband wireless receivers, low-noise amplifiers (LNAs), power amplifiers (PAs), and switch design.
Mr. Yan has served as a Technical Program Committee (TPC) Member or a Reviewer for IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IEEE IMWS-AMP) 2021 and IEEE International Symposium on Circuits and Systems (ISCAS) 2021. He was a recipient of the China National Scholarship two times during his bachelor’s and master’s programs. From February 2018 to June 2019, he was the Chair of the IEEE USTC-SSCS Student Chapter. He has been a Reviewer for several journals, including IEEE Microwave and Wireless Components Letters, IET Circuits, Devices & Systems, and Analog Integrated Circuits and Signal Processing.
研究兴趣
论文共 28 篇作者统计合作学者相似作者
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IEEE Trans. Circuits Syst. II Express Briefsno. 3 (2024): 1644-1649
IEEE Transactions on Circuits and Systems II: Express Briefsno. 99 (2024): 1-1
2023 IEEE MTT-S International Wireless Symposium (IWS)pp.1-3, (2023)
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IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERSno. 4 (2023): 1476-1488
IEEE Transactions on Circuits and Systems I-regular Papersno. 4 (2023): 1450-1462
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2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)pp.1-3, (2023)
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERSno. 4 (2023): 1450-1462
2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)pp.1-3, (2023)
2023 IEEE MTT-S International Wireless Symposium (IWS)pp.1-3, (2023)
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IEEE Transactions on Circuits and Systems II: Express Briefsno. 3 (2023): 924-928
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