基本信息
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Bio
Wendem T. Beyene (S'87–M'88–SM'05) was born in Addis Ababa, Ethiopia. He received the B.S. and M.S. degrees in electrical engineering from Columbia University, New York, in 1988 and 1991, respectively, and the Ph.D. degree in electrical and computer engineering from University of Illinois at Urbana-Champaign, Urbana-Champaign, in 1997.
In the past, he was employed by IBM, Hewlett-Packard, and Agilent Technologies. In 2000, he joined Rambus Inc., Los Altos, CA, where he is currently responsible for signal integrity of multi-gigabit parallel and serial interfaces.
Research Interests
Papers共 66 篇Author StatisticsCo-AuthorSimilar Experts
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IEEE transactions on components, packaging, and manufacturing technologyno. 1 (2021): 109-117
IEEE transactions on components, packaging, and manufacturing technologyno. 3 (2021): 451-461
Wendemagegnehu T. Beyene,Ashkan Hashemi,Changwook Yoon,Hyo-Soon Kang,Xiaoping Liu,Guang Chen, Karthik Chandrasekar,David Greenhill
Electronic Components and Technology Conferencepp.730-735, (2014)
2014 IEEE 23RD CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMSpp.35-38, (2014)
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Author Statistics
#Papers: 62
#Citation: 892
H-Index: 18
G-Index: 18
Sociability: 5
Diversity: 2
Activity: 0
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