Wei Keat LohIntel Corp关注立即认领分享关注立即认领分享基本信息浏览量:0职业迁徙个人简介暂无内容研究兴趣论文共 3 篇作者统计合作学者相似作者按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选时间引用量主题期刊级别合作者合作机构High Temperature Hygroscopic Swelling of Polymers in Electronic PackagingIan Chin,Wei Keat Loh, Seow Chien Keel,Yi He, Mohd Zulkifly Abdullah,Masahiro Tsuriya2024 International Conference on Electronics Packaging (ICEP)pp.59-60, (2024)引用0浏览0EIWOS引用00Low temperature interconnects in 1st level packaging and its challengesCharles Arvin,Sze Pei Lim,David Locker,Wei Keat Loh,Keith Sweatman, Francis Lee,Masahiro Tsuriya2022 International Conference on Electronics Packaging (ICEP)pp.7-8, (2022)引用0浏览0EIWOS引用00Low temperature 1st level interconnect in Packaging and its ChallengesSze Pei Lim,Charles Arvin,David Locker, Ravi Pokhrel,Wei Keat Loh,Keith Sweatman, Derek Daily, Naoki Kubota,Masahiro Tsuriya2021 International Conference on Electronics Packaging (ICEP)pp.49-50, (2021)引用3浏览0EIWOS引用30作者统计合作学者合作机构D-Core合作者学生导师暂无相似学者,你可以通过学者研究领域进行搜索筛选数据免责声明页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn