基本信息
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Bio
Research Field
Thermal design of advanced electronics packaging;
Design, simulation and fabrication of Micro heat sink, MEMS sensors and actuators.
Thermal design of advanced electronics packaging;
Design, simulation and fabrication of Micro heat sink, MEMS sensors and actuators.
Research Interests
Papers共 224 篇Author StatisticsCo-AuthorSimilar Experts
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Mingyu Zhang, Tan Yin,Zhiyuan Hu, Mengcheng Wang, Haokai Huang,Yanxin Zhang,Yongcun Hao, Honglong Chang,Yan Wang,Yunna Sun,Zhuoqing Yang,Guifu Ding
2024 IEEE 37TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMSpp.733-736, (2024)
Yahui Li,Qi Zhang,Yuhong Cao,Zhipeng Kang, Han Ren,Zhiyuan Hu,Mang Gao, Xiaole Ma,Jinyuan Yao,Yan Wang,Congchun Zhang,Guifu Ding,
ENERGY & ENVIRONMENTAL SCIENCEno. 10 (2023): 4620-4629
Journal of separation scienceno. 10 (2023)
NEMSpp.78-81, (2023)
Yongjin Wu, Changbei Ma,Jiangbo Luo, Yunnan Sun,Dongdong Xie,Guifu Ding,Kai Wang,Yan Wang,Zhuoqing Yang,Shengnan Shen
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
Zhongguo kexueno. 10 (2023): 1954-1969
ACS Catalysisno. 11 (2023): 7210-7220
bioRxiv (Cold Spring Harbor Laboratory) (2023)
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