基本信息
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Bio
Wei-Chung (Robert) Lo (Member, IEEE) received the Ph.D. degree from National Taiwan University, Taipei, Taiwan.
He joined the Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan, to work in advanced electronic packaging, such as Wafer Level Package (WLP), 3D Integrated Circuit (3-DIC)/ 3-D stacking, fan-out, and heterogeneous integration technology for more than 20 years, where he is currently the Deputy General Director of the Electronic and Optoelectronic System Research Laboratories (EOSL). He has authored 85 articles and holds 40 patents.
Dr. Lo currently serves as the TWG Chair of IoT Chapter of IEEE Heterogeneous Integration Roadmap (HIR) and the Chairperson of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan Chapter.
Research Interests
Papers共 97 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Ching Shih,Ming-Chun Hong,Chih-Yao Wang,Guan-Long Chen,Hsin-Han Lee,Kuan-Ming Chen, Bo-Chen Chiou,Yao-Jen Chang,Shan-Yi Yang, Sin-You Huang, Chiao-Yun Lo,Yi-Hui Su,
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
Chih-Cheng Hsiao,Chao-Kai Hsu, Ching-Iang Li, Yung-Sheng Chang,Ming-Ji Dai, Feng-Hsiang Lo,Chin-Hung Wang,Wei-Chung Lo
2024 International Conference on Electronics Packaging (ICEP)pp.181-182, (2024)
Tsung- Yu Ouyang,Yu-Min Lin, Yu-Ping Chan,Ou-Hsiang. Lee,Ching-Kuan Lee,Hsiang-Hung Chang,Chin-Hung Wang,Wei-Chung Lo, Po- Yao Chuang, Ying-Chung Tseng, Po-Hao Tsai,Michael Gallagher,
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
Y. T. Hung, J. Z. Huang,H. H. Chang,K. P. Huang, O. H. Lee,H. C. Chien, C. H. Wang,W. C. Lo, C. I. Wu, K. N. Chen
2024 International Conference on Electronics Packaging (ICEP)pp.1-2, (2024)
De Shieh, Zheng-Fong Lee, Ming-Yuan Lee,Hui-Yu Chen,Chang-Yan Hsieh,Po-Tsung Tu,Po-Chun Yeh,Shyh-Shyuan Sheu,Wei-Chung Lo,Shih-Chieh Chang,Chang-Hong Shen,Jia-Min Shieh,
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
Ou-Hsiang Lee,Wei-Lan Chiu,Hsiang-Hung Chang,Chia-Wen Chiang, Shih-Cheng Yu,Tsung-Yu Ou Yang, Su-Ching Hsiao,Ting-Yu Ko,Yu-Min Lin,Chin-Hung Wang,Wei-Chung Lo,Chia-Hsin Lee,
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1863-1867, (2024)
Yan-Cheng Guo,Tian-Sheuan Chang,Chih-Sheng Lin, Bo-Cheng Chiou, Chih-Ming Lai,Shyh-Shyuan Sheu,Wei-Chung Lo,Shih-Chieh Chang
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.319-324, (2024)
Jie Zhang,Wei Lu,Po-Tsang Huang,Sih-Han Li,Tsung-Yi Hung,Shih-Hsien Wu,Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen,Chin-Hung Wang,Shyh-Shyuan Sheu,Hung-Ming Chen,
S. Z. Rahaman, Y.-J. Chang,Y.-C. Hsin,S.-Y. Yang, F.-M. Chen,K.-M. Chen, I-J. Wang,H.-H. Lee, G.-L. Chen, Y.-H. Su, C.-Y. Shih,S.-C. Chiu,
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)pp.1-2, (2022)
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Author Statistics
#Papers: 85
#Citation: 975
H-Index: 19
G-Index: 26
Sociability: 6
Diversity: 2
Activity: 0
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