基本信息
views: 6
![](https://originalfileserver.aminer.cn/sys/aminer/icon/show-trajectory.png)
Bio
Vivek Chidambaram received the B.Eng. degree (Hons.) in manufacturing engineering from Anna University, India, the M.Sc. degree in materials science from the Royal Institute of Technology (KTH), Sweden, and the Ph.D. degree in materials engineering from the Technical University of Denmark. He has been with the Institute of Microelectronics, Agency for Science Technology and Research, since October 2010. His invention includes getter material, hermetic sealants, and bonding mechanisms. He has first-authored 15 peer reviewed journal articles and is the first inventor of 3 U.S. granted patents. His areas of expertise includes electronic materials, harsh environments packaging, wafer level packaging, and advanced packaging.
Research Interests
Papers共 37 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.426-431, (2021)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.438-444, (2021)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2019): 3-9
2019 Electron Devices Technology and Manufacturing Conference (EDTM)pp.339-341, (2019)
Load More
Author Statistics
#Papers: 38
#Citation: 740
H-Index: 14
G-Index: 26
Sociability: 4
Diversity: 1
Activity: 0
Co-Author
Co-Institution
D-Core
- 合作者
- 学生
- 导师
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn