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个人简介
Véronique Rochus received the M.S. degree in physics
engineering and the Ph.D. degree in applied science from the University of Liège, Liège, Belgium, in
2001 and 2006, respectively, and the D.E.A. degree in “Nanostructures et Microsystèmes pour
l’électronique et les communications“ from the University of Paris-Sud, Orsay, France, in 2002.
She worked on MEMS modelling as a Postdoctoral Researcher financed by the Belgian National Fund for Scientific
Research until 2010. During that period, she performed postdoctoral stays at TU Delft as well as at Kyoto University.
Afterwards, she joined the imec in 2010, where she is now a Senior Microsystems Design Engineer, actively contributing
to research in the field of microsystem design and modeling.
研究兴趣
论文共 150 篇作者统计合作学者相似作者
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Veronique Rochus, Zhiyuan Shen,Pieter Gijsenbergh, Antonia Malainou,Dominika Wysocka, Robert Ukropec, Alessandro Stoppato,Florian De Roose,Raf Appeltans,Xavier Rottenberg
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
Marios Gourdouparis,Chengyao Shi,Yuming He,Stefano Stanzione, Robert Ukropec,Pieter Gijsenbergh,Veronique Rochus,Nick Van Helleputte,Wouter A. Serdijn,Yao-Hong Liu
2024 IEEE 37TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMSpp.505-508, (2024)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-4, (2023)
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)pp.804-807, (2023)
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2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)pp.1-6, (2023)
2023 IEEE International Ultrasonics Symposium (IUS)pp.1-4, (2023)
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