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个人简介
Vladimir Cherman (Member, IEEE) received the M.Sc. and Ph.D. degrees in electronic engineering from Saint-Petersburg Electrotechnical University (ELTECH), Russia, in 1994 and 1999, respectively.
From 1997 to 2000, he was an Electronics Engineer with Morion Inc., St Petersburg, Russia. From 2000 to 2007, he was with the Ceramics Laboratory, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland, where his research was focused on microwave properties and applications of ferroelectric materials. He joined the Reliability and Modeling Group, IMEC, Leuven, Belgium, as a Researcher, in 2007, where he is involved in the study of chip package interaction (CPI) and reliability of 3-D integration solutions and electronic packages.
研究兴趣
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FLUIDSno. 3 (2024): 69
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.498-505, (2024)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
Melina Lofrano,Herman Oprins,Vladimir Cherman, Lisbeth Witters,Anne Jourdain,Geert Van der Plas,Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1036-1043, (2024)
Jaber Derakhshandeh, Anish Dangol, Tassawar Hussain, Heiko Stegmann,A. M. Vadiraj, Prathamesh Dhakras, Thomas Witters,Ehsan Shafahian, Punith Kumar M K,Carine Gerets,Aleksandar Radisic, Aldrin Vaquilar,
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.821-828, (2024)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
Xinyue Chang,Herman Oprins,Melina Lofrano,Vladimir Cherman,Bjorn Vermeersch, Javier Diaz Fortuny,Seongho Park,Zsolt Tokei,Ingrid De Wolf
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)pp.1-3, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.537-541, (2023)
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