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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 8 篇作者统计合作学者相似作者

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Development of Fine Pitch Backside Redistribution Layer (BRDL) Process in Fan Out Panel Level Packaging (FOPLP)
Hyunju Lee,Sung Keun Park,Kwangok Jeong, Jaemok Jung,Ju-il Choi,Un-Byoung Kang, Kuyoung Kim
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.515-519, (2023)
引用0浏览0EIWOS引用
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A Study on the Surface Activation of Cu and Oxide for Hybrid Bonding Joint Interface
Bohee Hwang, Sanwi Kim,Jeonghwan Lee,Soohwan Lee,Youngkun Jee,Sangcheon Park,Gyeongjae Jo, Kwangbae Kim, Sungjin Han,Ilhwan Kim,Jumyong Park,Hyunchul Jung,
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.78-82, (2023)
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Realization of high A/R and fine pitch Cu pillars incorporating high speed electroplating with novel strip process
Se-Chul Park, Jong-Ho Park, Seonghoon Bae, Junyoung Park, Taehwa Jung,Hyojin Yun,Kwangok Jeong, Seok-Bong Park, Ju-Il Choi,Un-Byoung Kang,Dongwoo Kang
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1005-1009, (2022)
引用1浏览0EIWOS引用
1
0
Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics
Min-Ki Kim, Soojeoung Park,Aeni Jang,Hyuekjae Lee,Seungduk Baek,ChungSun Lee,Ilhwan Kim,Jumyong Park,Youngkun Jee,Un-Byoung Kang,Dae-Woo Kim
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.335-339, (2022)
引用8浏览0EIWOS引用
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Novel Approach o Highly Robust Fine Pitch RDL Process
Juil Choi, Jeongi Jin, Gyuho Kang, Hyunsu Hwang,Byungchan Kim,Hyojin Yun,Jumyong Park,Chungsun Lee,Un-Byoung Kang,Jongho Lee
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2246-2251, (2021)
引用1浏览0EIWOS引用
1
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Fluorescence Microscopy Methodology for Visualizing Microscale Interfacial Defects In Packaging Materials
Nhi Quach,Ilhwan Kim,Jong-Hyeon Chang,ChungSun Lee,Un-Byoung Kang,JongHo Lee,Yoonjin Won
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021)pp.1154-1161, (2021)
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