Tomas Webers - IMEC | 人才画像

基本信息

Career Trajectory

Bio

Tomas Webers received the M.S. degree in electrical engineering from the Free University of Brussels (VUB), Brussels, Belgium, in 1996. In 1997, he joined the Design for Analog and RF Technologies and Systems Group (DARTS), IMEC, Leuven, Belgium, where he is involved in designing and testing high density interconnections and packages, and research in the field of thin film technology.

Research Interests

Papers共 18 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding Down to 400 Nm Interconnect Pitch

Boyao Zhang,Soon-Aik Chew,Michele Stucchi,Sven Dewilde,Serena Iacovo,Liesbeth Witters,Tomas Webers,Koen Van Sever,Joeri De Vos,Andy Miller,Gerald Beyer,Eric Beyne

PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.312-318, (2024)

Cited0Views0EIWOSBibtex

Confined IMCs for Low Temperature and High Throughput D2W Bonding

Jaber Derakhshandeh,Douglas Charles La Tulipe,Giovanni Capuz,Vladimir Cherman,Carine Gerets,Tom Cochet,Ehsan Shafahian,Inge De Preter,Geraldine Jamieson,Tomas Webers,Eric Beyne,Gerald Beyer,Andy Miller

2022 International Conference on Electronics Packaging (ICEP) (2022)

Cited0Views0EIWOSBibtex

(Why Do We Need) Wireless Heterogeneous Integration (Anyway?)

M. Peeters, S. Sinha,Xiao Sun,Claude Desset,Giuseppe Gramegna,John Slabbekoorn,Pieter Bex, N. Pinho,Tomas Webers,Dimitrios Velenis,A. Miller,Nadine Collaert,Geert Van der Plas,Eric Beyne,M. Huynen, R. Broucke

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)（2022）

Cited4Views0EIWOSBibtex

Low Temperature Backside Damascene Processing on Temporary Carrier Wafer Targeting 7μm and 5μm Pitch Microbumps for N Equal and Greater Than 2 Die to Wafer TCB Stacking

Jaber Derakhshandeh,Eric Beyne,Gerald Beyer,Giovanni Capuz,Vladimir Cherman,Inge De Preter,Carine Gerets,Ehsan Shafahian,Koen Kennes,Geraldine Jamieson,Tom Cochet,Tomas Webers,Bert Tobback,Geert Van der Plas,Douglas Charles La Tulipe,Alain Phommahaxay,Andy Miller

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)

Cited8Views0EIWOSBibtex

Integrated Magnetic Cores in FOWLP and Their Applications

Xiao Sun,John Slabbekoorn,Dimitrios Velenis,Pieter Bex,Fabrice Duval,Tom Sterken,Giacomo Talmelli,Inge de Preter,Tomas Webers,Christoph Adelmann,Andy Miller,Geert Van der Plas,Eric Beyne

2020 IEEE 70th Electronic Components and Technology Conference (ECTC)（2020）

Cited0Views0EIWOSBibtex

3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding Versus Dielectric Via-Last Bonding

Herman Oprins,Vladimir Cherman,Tomas Webers,Soon-Wook Kim,Joeri de Vos,Geert Van der Plas,Eric Beyne

PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN E...（2020）

Cited17Views0EIWOSBibtex

10 and 7 Μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar and Metal Spacer Process

Jaber Derakhshandeh,Giovanni Capuz,Vladimir Cherman,Fumihiro Inoue,Inge De Preter,Lin Hou,Pieter Bex,Carine Gerets,Fabrice Duval,Tomas Webers,Julien Bertheau,Stefaan Van Huylenbroeck,Alain Phommahaxay,Ehsan Shafahian,Geert Van der Plas,Eric Beyne,Andy Miller,Gerald Beyer

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.617-622, (2020)

Cited16Views0EIWOSBibtex

Thermal Characterization of the Inter-Die Thermal Resistance of Hybrid Cu/dielectric Wafer-to-wafer Bonding

Herman Oprins,Vladimir Cherman,Tomas Webers,Abdellah Salahouelhadj,Soon-Wook Kim,Lan Peng,Geert Van der Plas,Eric Beyne

Journal of Electronic Packaging（2017）

Cited19Views0EIWOSBibtex

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