基本信息
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Bio
Tomas Webers received the M.S. degree in electrical engineering from the Free University of Brussels (VUB), Brussels, Belgium, in 1996.
In 1997, he joined the Design for Analog and RF Technologies and Systems Group (DARTS), IMEC, Leuven, Belgium, where he is involved in designing and testing high density interconnections and packages, and research in the field of thin film technology.
Research Interests
Papers共 16 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.312-318, (2024)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.1108-1113, (2022)
2022 International Conference on Electronics Packaging (ICEP)pp.131-132, (2022)
M. Peeters, S. Sinha, Xiao Sun,Claude Desset,Giuseppe Gramegna,John Slabbekoorn,Pieter Bex, N. Pinho,Tomas Webers,Dimitrios Velenis,A. Miller,Nadine Collaert,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.1108-1113, (2022)
Jaber Derakhshandeh, Carine Gerets, Fumihiro Inoue,Giovanni Capuz, Vladimir Cherman, Melina Lofrano, Lin Hou, Tom Cochet,Inge De Preter,Tomas Webers, Pieter Bex,Geraldine Jamieson,
Electronic Components and Technology Conferencepp.1119-1124, (2021)
Herman Oprins, Vladimir Cherman,Tomas Webers,Soon-Wook Kim, Joeri de Vos, Geert Van der Plas, Eric Beyne
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.617-622, (2020)
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Author Statistics
#Papers: 16
#Citation: 107
H-Index: 7
G-Index: 10
Sociability: 4
Diversity: 2
Activity: 1
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