基本信息
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Career Trajectory
Bio
Dr. Tiwei Wei is currently the Assistant Professor at Purdue University, School of Mechanical Engineering. He was a postdoctoral research scholar in the NanoHeat lab at Stanford University. He received his Ph.D. degree in the 3D system integration department at Interuniversity Microelectronics Centre (imec) and KU Leuven, Belgium in 2020. He joined imec in 2015, starting his Ph.D. research by developing electronic cooling solutions for high-performance 3D systems. Before joining imec, he worked as a researcher staff at Tsinghua University and Hong Kong University of Science and Technology, from 2011 until 2015, where he worked on advanced microelectronic packaging techniques. He serves on the session chair and technical program committee of several electronic packaging conferences, including IEEE ESTC, REPP, 3DIC, and EPTC. He is currently the vice-chair of the IEEE Electronic Packaging Society (EPS) Silicon Valley Chapter. His research interests include advanced electronic packaging, heterogeneous 3D integration, and thermal packaging management.
Research Interests
Papers共 49 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.834-841, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.563-570, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1485-1492, (2024)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
JOURNAL OF ELECTRONIC PACKAGINGno. 1 (2024)
Yujui Lin,Tiwei Wei, Wyatt Jason Moy,Hao Chen,Man Prakash Gupta, M.W. Degner,Mehdi Asheghi,Alan Mantooth,Kenneth E. Goodson
Journal of Electronic Packagingno. 2 (2023)
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
Journal of Electronic Packagingpp.1-45, (2023)
JOURNAL OF ELECTRONIC PACKAGINGno. 2 (2023)
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Author Statistics
#Papers: 43
#Citation: 346
H-Index: 11
G-Index: 17
Sociability: 4
Diversity: 1
Activity: 1
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