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Papers共 57 篇Author StatisticsCo-AuthorSimilar Experts
By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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K. Varga,R. Holly,T. Zenger, A. Spitzer, F. Bögelsack,T. Uhrmann, S. Vanclooster, M. Reybrouck, D. Janssen, N. Van Herck, M. Vandevyvere
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
Ksenija Varga,Thomas Uhrmann,Roman Holly,Tobias Zenger,Boris Považay,Dimitri Janssen, Niels van Herck, Mario Reybrouck, Marieke Vandevyvere, Sanjay Malik, Stefan Vanclooster
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1364-1369, (2024)
François Chancerel, Peter Urban,John Slabbekoorn, Simon Halas,Julian Bravin,Steven Brems,Thomas Uhrmann,Markus Wimplinger,Alain Phommahaxay,Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.343-347, (2024)
K. Varga,M. Weinhart,R. Holly, T. Zenger,B. Povazay, F. Boegelsack, A. Spitzer,T. Uhrmann,H. Takishita, Y. Taguchi, J. Koch, M. Schicke
NOVEL PATTERNING TECHNOLOGIES 2024 (2024)
Direct Copper Interconnection for Advanced Semiconductor Technologypp.201-221, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.386-393, (2024)
Markus Schindler, Severin Ringelstetter,Mariana Pires, Mikhail Begel, Andrea Kneidinger, Florian Kleinpötzl,Thomas Uhrmann,Markus Wimplinger,Elisabeth Brandl
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.860-864, (2024)
Kai Ma,Nikolaos Bekiaris, Ching-Hsiang Hsu, Lei Xue,Sesh Ramaswami,Taotao Ding,Gernot Probst, Tobias Wernicke,Thomas Uhrmann,Markus Wimplinger
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.331-336, (2024)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1410-1417, (2023)
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
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Author Statistics
#Papers: 54
#Citation: 133
H-Index: 7
G-Index: 11
Sociability: 5
Diversity: 1
Activity: 0
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