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Papers共 57 篇Author StatisticsCo-AuthorSimilar Experts

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Semiconductor Traceability: Die Annotations Patterning by Maskless Exposure Technology
K. Varga,R. Holly,T. Zenger, A. Spitzer, F. Bögelsack,T. Uhrmann, S. Vanclooster, M. Reybrouck, D. Janssen, N. Van Herck, M. Vandevyvere
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
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Ultra High Density RDL Patterning of High–Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence
Ksenija Varga,Thomas Uhrmann,Roman Holly,Tobias Zenger,Boris Považay,Dimitri Janssen, Niels van Herck, Mario Reybrouck, Marieke Vandevyvere, Sanjay Malik, Stefan Vanclooster
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1364-1369, (2024)
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Maskless Exposure of Die Annotations and Image Sensor Patterns Employing 7th Generation RGB Resists
K. Varga,M. Weinhart,R. Holly, T. Zenger,B. Povazay, F. Boegelsack, A. Spitzer,T. Uhrmann,H. Takishita, Y. Taguchi, J. Koch, M. Schicke
NOVEL PATTERNING TECHNOLOGIES 2024 (2024)
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Permanent and Temporary Wafer Bonding
Viorel Dragoi,Thomas Uhrmann,Paul Lindner
Direct Copper Interconnection for Advanced Semiconductor Technologypp.201-221, (2024)
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Development of UV-curable Molding Materials with Minimum Die-Shift for FOWLP/FOPLP
Markus Schindler, Severin Ringelstetter,Mariana Pires, Mikhail Begel, Andrea Kneidinger, Florian Kleinpötzl,Thomas Uhrmann,Markus Wimplinger,Elisabeth Brandl
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.860-864, (2024)
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0.5 Μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer
Kai Ma,Nikolaos Bekiaris, Ching-Hsiang Hsu, Lei Xue,Sesh Ramaswami,Taotao Ding,Gernot Probst, Tobias Wernicke,Thomas Uhrmann,Markus Wimplinger
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.331-336, (2024)
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Wafer Bonding as Next Generation Scaling Booster
T. Wernicke, P. Lindner,T. Uhrmann,M. Wimplinger
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
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Author Statistics

#Papers: 54

#Citation: 133

H-Index: 7

G-Index: 11

Sociability: 5

Diversity: 1

Activity: 0

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