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个人简介
Thomas Brunschwiler (M’10–SM’13) received the Ph.D. degree in electrical engineering from the Technical University of Berlin, Berlin, Germany, with a focus on interlayer thermal management of high-performance microprocessor chip stacks.
He is currently a Research Staff Member with the Smart System Integration Team, IBM Research–Zurich, Rüschlikon, Switzerland. He conducts physical research and coordinates governmental and joint projects. In this respect, he is pushing the frontiers in functional electronic packaging toward scalable heat removal and power delivery, supporting performance, and efficient scaling of high-end servers. He is also coordinating two European funded research projects, HyperConnect.eu and CarrICool.eu, with the goal to provide percolating thermal underfills, all-copper interconnects and a silicon-interposer with heat-removal, voltage regulation, and optical communication capabilities. He supported the lab director of IBM Research–Zurich as a Technical Assistant on strategic matters. He has authored and coauthored more than 90 publications and three book chapters. He holds more than 50 patents.
Dr. Brunschwiler was with the Board of the Swiss Physical Society. He is currently the General Chair of ITherm and is part of the IEEE Components, Packaging and Manufacturing Technology Society Board of Governors.
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Carlos Gomes,Thomas Brunschwiler
crossref(2024)
Thomas Brunschwiler, Tobia Claglüna,Michal Muszynski, Tobias Hölzer,Paolo Fraccaro,Maciel Zortea,Jonas Weiss
Proceedings of the AAAI Symposium Seriesno. 1 (2024): 40-45
IGARSS 2023 - 2023 IEEE INTERNATIONAL GEOSCIENCE AND REMOTE SENSING SYMPOSIUM (2023): 5638-5641
crossref(2023)
CoRRno. 1 (2023): 115-123
PROCEEDINGS OF THE 25TH INTERNATIONAL CONFERENCE ON MULTIMODAL INTERACTION, ICMI 2023pp.84-93, (2023)
2022 IEEE 10th International Conference on Healthcare Informatics (ICHI)pp.143-150, (2022)
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